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XZZ L23 CPU Reballing Stencil Platform For iPhone A8-A16 BGA Repair TBK Bubble Remover For iPhone/ Samsung/Huawei/

SKU 98384691748
4.6
USD25.89 USD59.89 Gallery price

Pay in 4 interest-free payments of $6.47 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 10 - Sep 15

Details & care
Description

Bubble Remover For iPhone/ Samsung/Huawei/ Xiaomi/ HTC/ Motolora/ Oppo/ LG/ SONY

upgrade the system software through the USB

Cleaning kit:

· Free ROTS Operating system

XZZ L23 CPU Reballing Stencil Platform For iPhone A8-A16 BGA Repair TBK Bubble Remover For iPhone/ Samsung/Huawei/XZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone A8 A16 Qualcomm MTK Hisilicon CPU tin planting. XZZ L23 BGA Reballing Stencil Platform for iPhone 6 to 14 Pro Max A8 A9 A10 A12 A13 A14 A15 A16, Qualcomm, MTK, Hisilicon CPU IC soldering repair. Features: Magnetic power positioning with strong magnetic force and automatic alignment. Built in powerful magnets with strong adsorption for easy pick up and fast maintenance. Easy to operate

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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